Autosamdri®-815B, Series C

  • Process up to 4" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8780D
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  Operational Demo Video
  • The Autosamdri®-815B, Series C maintains tousimis® process quality and achieves a small facility foot print while utilizing an efficient closed loop refrigeration and waste alcohol collection design.*

  • 35 years of tousimis® CPD experience enables smooth operation and precise control. HF Compatible Wafer Holders* and Chamber Inserts* are provided allowing anti-stiction MEMS processing of various wafer sizes and die.
Features
  • High efficiency internal closed loop refrigeration.* (22°C to operational in less than 3 minutes)!
  • Post-Purge-Filter easily accessible for maintenance ease.*
  • The patented internal SOTER™ condenser* quietly captures and separates CO2 exhaust and waste alcohols.
  • Unique chamber inserts* enable variance of chamber I.D. maximizing efficiency in LCO2 consumption, process time, and providing multiple size wafer process capability!
  • Process up to 5 x 4" wafers per process run. Also comes with additional HF Compatible Wafer Holders* to process 5 x 3", 5 x 2" diameter wafers or 5 x 10mm square die (tousimis® HF compatible Wafer Holders* may be used to etch and process your wafers minimizing handling).
  • Chamber illumination with viewing window facilitates chamber status visualization.*
  • Microprocessor controller allows for complete automatic processing.*
  • All internal surfaces are inert to CO2 and ultra pure alcohols.
  • Repeatable operating parameters insuring "reproducibility" of results.
  • Static pressure control module helps insure automatic safe pressure stability.
  • Internal filtration system delivers clean LCO2 into process chamber down to 0.08µm.
  • Control panel LED's instantly indicate process mode at a glance.
  • Clean room static-free compatible design.
  • All electronic components meet CE, UL and/or U.S. Military Specifications.
Specifications
  • Cabinet: 19.8" (50.3cm) Width x 31.7" (80.6cm) Depth x 44.5" (113.0cm) Height
  • System Set-Up Area Footprint: 27" (68.6cm) Width x 38" (96.5cm) Depth.
  • Chamber size: 4.50" I.D. x 1.25" Depth / Chamber volume: 326 ml
  • Temperature gauge range: -30°C to 60°C, Pressure gauge range: 0 to 2,000 psi
  • 120V / 50-60Hz (Other voltage units also available. Please Inquire)
  • LCO2 flow is controlled through Micro Metering Valves with Vernier handles for easily control flow rates.*
Standard Accessories
  • LCO2 High Pressure braided stainless steel inert Teflon® lined hose. 10ft (~ 3m) long for clean room operation (at a nominal charge, other lengths available upon request ).
  • Double T-Filter Assembly (#8785) pre-installed onto the chamber LCO2 supply high-pressure hose. Flows LCO2 twice thru 0.5µm filters with 99.5% particulate retention prior to LCO2 entering Autosamdri®-815B.
  • Tool set included for connecting LCO2 chamber supply line
  • Static free exhaust tubing for all exhaust outlets.
  • Internal stainless and nickel scintered filtration systems incorporated to protect lines, wafers, and valves down to 0.08µm.
  • Spare chamber O-ring (3), chamber lamp (1), and slo-blow fuses (2x3A and 2x8A).
  • Complete wafer size process flexibility! 3 chamber inserts* enable 4.5" chamber ID reduction down to smaller chamber ID sizes for processing wafers and die from a range including: 4", 3", 2", and 1.25" ! Allows for multiple wafer size drying.
  • 4", 3", 2" diameter wafer holders and 10mm square die holders included. Holders are HF compatible and can hold up to 5 wafers or die each.
  • 2 year warranty on all parts and labor. Free lifetime technical support consultation by our scientific staff.
Optional Accessories
  • 8760-02: :KNURL NUT for 4" and 6" Process Chamber
  • 8760-41: :3 AMP FUSE for Autosamdri®, Automegasamdri® and Touchscreen Series C
  • 8760-42: :8 AMP FUSE for Autosamdri®, Automegasamdri® and Touchscreen Series C
  • 8770-10: :CHAMBER LAMP, 120Volt/60Hz
  • 8770-32: :HIGH-PRESSURE HOSE, 5ft
  • 8770-33: :HIGH-PRESSURE HOSE, 10ft
  • 8770-60: :CHAMBER LID for 4" Process Chamber
  • 8785: :Double T-Filter Assembly
  • 8770-83B: :0.5µm Stainless Steel Particulate Filter Element for LCO2 T-Filter or External Purge Line Filter.
  • 8784-05: :Gasket for LCO2 Tank Connect
  • 8770-51T/815B: :O-Ring for Autosamdri®-934 and Autosamdri®-815B
  • 8770-46: :Flow Meter - Use with any 2.5", 3.4" and 4.0" dia. Autosamdri® Chamber (60 SCFH)
  • 8770-53: :POWER CABLE
  • 8770-54: :LCO2 TANK SCALE W/ REMOTE DISPLAY
  • 8770-56A: :Step-Down Transformer, 200-240V → 110-120V, 3000W
  • 8770-83A: :Internal 0.5µm 316SS Particulate Line Filter
  • 8768B: :4" - 100mm HF Compatible Wafer Holder
    Holds 5 Wafers
  • 8768C: :3" - 75mm HF Compatible Wafer Holder
    Holds 5 Wafers
  • 8768D: :2" - 50mm HF Compatible Wafer Holder
    Holds 5 Wafers
  • 8768G: :1" - 25mm HF Compatible Wafer Holder
    Holds 5 Wafers
  • 8768E: :10mm Square HF Compatible Chip Holder, Holds 5 Die
CPD MULTI-APPLICATIONS

Application Images

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E-beam resist pattern quality after CPD Process NRL Nano Fab - Washingtopn, DC

Released cantilevers after thermal annealing Universite Catholique de Louvain

E-beam resist pattern quality after CPD Process NRL Nano Fab - Washingtopn, DC

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