MEMS Drying Systems

The Samdri^® line of Supercritical Point Dryers is successfully used to increase yield and uniformity of MEMS devices. Liquid carbon dioxide is the transitional fluid used to process your delicate MEMS. The tousimis Samdri^® line of Supercritical Point Drying tools used for the MEMS CO2 dry release after wet etching is a most beneficial anti-stiction tool for the MEMS fab.

	Automegasamdri®-916B, Series C Low LCO2 Consumption. Auto-Process up to 5 - 8" wafers in Less than 1 hour. Small Foot Print design. Minimal Facility Utility Requirements. Unique Patented Features. tousimis catalog# 8786D

	Automegasamdri®-915B, Series C Low LCO2 Consumption. Auto-Process up to 5 - 6" wafers in Less than 1 hour. Small Foot Print design. Minimal Facility Utility Requirements. Unique Patented Features. tousimis catalog# 8785D

	Automegasamdri®-915B, Series B Automatic Supercritical Point Dryer Process 5 wafers up to 6" in diameter Clean Room Compatible tousimis catalog# 8785C

	Autosamdri®-815B, Series C Low LCO2 Consumption. Auto-Process up to 5 - 4" wafers in Less than 1 hour. Small Foot Print design. Minimal Facility Utility Requirements. Unique Patented Features. tousimis catalog# 8780D

	Autosamdri®-815B, Series B Automatic Supercritical Point Dryer Process 5 wafers up to 4" in diameter Clean Room Compatible tousimis catalog# 8780C

	Autosamdri®-815, Series B Automatic Supercritical Point Dryer Process 5 x 10mm sq. die or 5 x 1" diameter wafers Clean Room Compatible tousimis catalog# 8779C

View Autosamdri® MEMS Release Tool Presentation.

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Click Here for Non-Clean Room Versions Critical Point Dryers

* Most Samdri®, Autosamdri® and Automegasamdri® feature U.S. patents (#6,493,964, #6,678,968) or patents pending.
Note: Actual delivered model or accessories may vary slightly, as advancements are being applied constantly.

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