Critical Point Dryers (Cleanroom Versions)



The Samdri® line of Supercritical Point Dryers is successfully used to increase yield and uniformity of MEMS devices. Liquid carbon dioxide is the transitional fluid used to process your delicate MEMS. The tousimis Samdri® line of Supercritical Point Drying tools used for the MEMS CO2 dry release after wet etching is a most beneficial anti-stiction tool for the MEMS fab.
 

Automegasamdri®-916B, Series C

  • Low LCO2 Consumption.
  • Auto-Process up to 5 - 8" wafers in Less than 1 hour.
  • Small Foot Print design.
  • Minimal Facility Utility Requirements.
  • Unique Patented Features.
tousimis catalog# 8786D

Automegasamdri®-915B, Series C

  • Low LCO2 Consumption.
  • Auto-Process up to 5 - 6" wafers in Less than 1 hour.
  • Small Foot Print design.
  • Minimal Facility Utility Requirements.
  • Unique Patented Features.
tousimis catalog# 8785D

Automegasamdri®-915B, Series B

  • Automatic Supercritical Point Dryer
  • Process 5 wafers up to 6" in diameter
  • Clean Room Compatible
tousimis catalog# 8785C

Autosamdri®-815B, Series C

  • Low LCO2 Consumption.
  • Auto-Process up to 5 - 4" wafers in Less than 1 hour.
  • Small Foot Print design.
  • Minimal Facility Utility Requirements.
  • Unique Patented Features.
tousimis catalog# 8780D

Autosamdri®-815B, Series B

  • Automatic Supercritical Point Dryer
  • Process 5 wafers up to 4" in diameter
  • Clean Room Compatible
tousimis catalog# 8780C

  931 Series SAMDRI®

  • with Stasis Programming (Patent pending)
  • Multi Application Critical Point Dryer
  • Available in 1.25", 2.5" and 3.4"

931 Series


Autosamdri®-815, Series B

  • Automatic Supercritical Point Dryer
  • Process 5 x 10mm sq. die or 5 x 1" diameter wafers
  • Clean Room Compatible
tousimis catalog# 8779C

 

Click Here for Non-Clean Room Versions Critical Point Dryers

 
    * Most Samdri®, Autosamdri® and Automegasamdri® feature U.S. patents (#6,493,964, #6,678,968) or patents pending.
    Note: Actual delivered model or accessories may vary slightly, as advancements are being applied constantly.  
 
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