Applications
The Samdri® line of Supercritical Point Dryers is successfully used to increase yield and uniformity of MEMS devices. Liquid carbon dioxide is the transitional fluid used to process your delicate MEMS. The tousimis Samdri® line of Supercritical Point Drying tools used for the MEMS CO2 dry release after wet etching is a most beneficial anti-stiction tool for the MEMS fab.

Autosamdri®-931

     

Advanced Digital Multi-application Dryer

  • Patent Pending "Stasis Software" for Challenging Sample Types
  • Available in 1.25", 2.50" and 3.40" chamber sizes
  • Winner of 2012 Microscopy Today Innovation Award
  • Built-in Internal Condenser
  • Delicate Slow Fill Path Through for Delicate Samples
  • Precision process control
  • Internal Filtration System Down to 0.08µm
  • Optional "Quick Release" sample holder (down to 2 µm in size)
  • Program and save custom recipes
  • Made in U.S.A.

More Information


  • Process up to 5 x 1" wafers
  • Automatic Supercritical Point Dryer
  • Minimal Facility Utility Requirements
  • Filtration down to 0.08µm
  • Made in U.S.A.
tousimis catalog# 8779C

More Information


  • Process up to 5 x 4" wafers
  • Automatic Supercritical Point Dryer
  • Minimal Facility Utility Requirements
  • Filtration down to 0.08µm
  • Made in U.S.A.
tousimis catalog# 8780C

More Information


  • Process up to 5 x 6" wafers
  • Automatic Supercritical Point Dryer
  • Minimal Facility Utility Requirements
  • Filtration down to 0.08µm
  • Made in U.S.A.
tousimis catalog# 8785C

More Information


  • Process up to 5 x 4" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Internal Condenser
  • Closed Loop Cooling
  • Filtration down to 0.08µm
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8780D

More Information


  • Process up to 5 x 6" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Internal Condenser
  • Closed Loop Cooling
  • Filtration down to 0.08µm
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8785D

More Information


  • Process up to 5 x 8" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Internal Condenser
  • Closed Loop Cooling
  • Filtration down to 0.08µm
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8786D

More Information

Request CPD Quotation

Upcoming Exhibitions and Conferences

Visit us at the 30th IEEE International Conference on
Micro Electro Mechanical Systems (MEMS 2017)

Date: January 22-26, 2017

Location: Rio Las Vegas Hotel and Casino, Las Vegas, Nevada

Booth: # 28

Visit us at The Texas Society for Microscopy 52nd annual meeting

Date: February 24 - 25, 2017

Location: Waco Convention Center, Waco, Texas