Applications
The Samdri® line of Supercritical Point Dryers is successfully used to increase yield and uniformity of MEMS devices. Liquid carbon dioxide is the transitional fluid used to process your delicate MEMS. The tousimis Samdri® line of Supercritical Point Drying tools used for the MEMS CO2 dry release after wet etching is a most beneficial anti-stiction tool for the MEMS fab.

Touch Screen Series C

     

Programmable Series C Systems for 4", 6" AND 8" Wafers

  • A dedicated slow fill line allows for ideal internal chamber fluid dynamics for the most sensitive devices
  • Thermostatically controlled internal condenser
  • Temperature controlled valving
  • Stainless steel tubing with an internal filtration system down to 0.08 µm to protect samples and system function
  • Non mechanical stirring chamber allowing for fluid dynamic exchange without the need for particle generating friction causing devices
  • Chamber flexibility with inserts and holders allowing for processing processing up to 8" wafers, pieces and die
  • Made in U.S.A.

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Autosamdri®-931

     

Advanced Digital Multi-application Dryer

  • Patent Pending "Stasis Software" for Challenging Sample Types
  • Available in 1.25", 2.50" and 3.40" chamber sizes
  • Winner of 2012 Microscopy Today Innovation Award
  • Built-in Internal Condenser
  • Delicate Slow Fill Path Through for Delicate Samples
  • Precision process control
  • Internal Filtration System Down to 0.08µm
  • Optional "Quick Release" sample holder (down to 2 µm in size)
  • Program and save custom recipes
  • Made in U.S.A.

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  • Process up to 5 x 1" wafers
  • Automatic Supercritical Point Dryer
  • Minimal Facility Utility Requirements
  • Filtration down to 0.08µm
  • Made in U.S.A.
tousimis catalog# 8779C

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  • Process up to 5 x 4" wafers
  • Automatic Supercritical Point Dryer
  • Minimal Facility Utility Requirements
  • Filtration down to 0.08µm
  • Made in U.S.A.
tousimis catalog# 8780C

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  • Process up to 5 x 6" wafers
  • Automatic Supercritical Point Dryer
  • Minimal Facility Utility Requirements
  • Filtration down to 0.08µm
  • Made in U.S.A.
tousimis catalog# 8785C

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  • Process up to 5 x 4" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Internal Condenser
  • Closed Loop Cooling
  • Filtration down to 0.08µm
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8780D

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  • Process up to 5 x 6" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Internal Condenser
  • Closed Loop Cooling
  • Filtration down to 0.08µm
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8785D

More Information


  • Process up to 5 x 8" wafers
  • Fully Automatic Process
  • Low LCO2 Consumption
  • Small Foot Print design
  • Internal Condenser
  • Closed Loop Cooling
  • Filtration down to 0.08µm
  • Minimal Facility Utility Requirements
  • Made in U.S.A.
tousimis catalog# 8786D

More Information

Request CPD Quotation

Application Images

RF MEMS Capacitive Switch NASA-Glenn Research Center/Communications Technology Division, USA

Released cantilevers after thermal annealing Universite Catholique de Louvain

Silicon Microrobots - Leg of Robot University of California at Berkeley and Micropropulsion Corp. USA

MEMS Shock Sensor (Multi-Directional) Naval Surface Warfare Center Indian Head, MD

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